Heat Sinks and CuW
Mi-tech developed CuW to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. As a copper tungsten composite, it utilizes the thermal advantages of copper and the very low expansion characteristics of tungsten.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of CuW's thermal conductivity and expansion characteristics, it works well in densely packed circuits.
Features of CuW include:
- Minimizes thermal stress
- Can be mounted to directly
- Can be plated with silver, gold, nickel, and copper
- Readily brazable without distortion or loss of physical properties
- Non-magnetic
- Maintains high physical properties over a wide range of temperatures
- Remains stable during temperature cycling
- High electrical conductivity, varying with the grade
- Superior thermal conductivity
- Various grades are available to match the characteristics and requirements of the material attached to it
- Can be readily machined into complicated shapes
- Parts can often be made to net or near net shape, because they are manufactured by powder metallurgy
Availability: Rounds and shapes are made to order.
| Mi-Tech Grade | Rockwell Hardness | Thermal Expansion In/InoCx10-6 at 20o | Thermal Conductivity W/CM- oC 20-400 oC | Specific Heat J/KG-oC at 20 o | Density GMS/CC |
| CW75HS | 94 B | 10.22 | 1.89 | 201 | 14.7 |
| CW80HS | 98 B | 9.2 | 1.82 | 188 | 15.56 |
| CW85HS | 102 B | 7.97 | 1.75 | 176 | 16.19 |
| CW90HS | 106 B | 6.49 | 1.47 | 163 | 17.06 |
Thermal Expansion
Thermal Conductivity
